Chipmakers are preparing for production of Apple's sixth-generation iPhone, including Qualcomm, which is said to be providing high-speed 4G long-term evolution chips produced using a 28-nanometer process.

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Apple supplier Broadcom has been pegged as the most likely customer to have given Taiwan Semiconductor Manufacturing Co. a boost through a recent batch of "rush orders," with some analysts suggesting that the last-minute orders are for the next-generation iPhone.

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U.S. publishers are reportedly negotiating tablet-related content deals with Apple in New York; a list of potential component suppliers for the hardware has surfaced, including a P.A. Semi-designed processor; and new allegations claim Time Inc. has little knowledge of the tablet.

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The next version of the Bluetooth short-range wireless protocol officially launched this week, promising an eightfold speed increase to boost the low power protocol into the same performance range as WiFi wireless networking, while allowing Bluetooth 3.0 devices to fall back to lower power mode when not actively transferring data.

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Over the past 48 hours, a couple of new reports have come out of the Far East claiming to identify up to three new models of Apple's iPhone due this year and a list of component suppliers who'll play an integral role.

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Wireless radio component specifications contained within beta distributions of iPhone 3.0 firmware reveal support for a new chip enabling low power 802.11n that's bound for Apple's third-generation iPod touch. It's therefore also likely to be included with new iPhone models.

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Many have made guesses as to what chipsets are inside iPhone 3G, but research firms Portelligent and Semiconductor Insights have cracked the mystery and have explained each chip in one of the most detailed Apple product teardowns yet.

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A late leak has allegedly revealed the inner workings of the next-generation iPhone's cellular chipset, down to its specific parts and most of its capabilities.

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