With Apple believed to be in the final stages of preparation to begin manufacturing its next-generation iPhones, a slightly redesigned Touch ID component said to be headed for the so-called iPhone 6 has surfaced from Japan.
Apple appears to have slightly reconfigured the iPhone 6's internal layout, as the purported Touch ID module has had its mounting bracket moved to the opposite side of the ribbon cable. The part was revealed by ascii.jp and first noticed by nowhereelse.fr.
The sensor itself also seems to have been slightly redesigned, with new shielding on the rear and a slight alteration of its overall shape.
It is unclear at what stage of manufacturing the parts were photographed. Though they came from Japanese media, the Touch ID sensor components are fabricated in Taiwan by chip firm TSMC and likely assembled by a second partner either in Taiwan or mainland China.
The same website previously published purportedly leaked images of a "manufacturing mockup" of the 4.7-inch iPhone 6. Apple is also thought to be prepping a larger, 5.5-inch "phablet" variant and both are expected to feature a relocated sleep/wake button and a next-generation "A8" processor.