Rumblings out of Apple's East Asian supply chain this week offer fresh insight into this year's iPhone release cycle, with a report on Monday claiming the company's 2020 handsets will be similar in design to the iPhone 11 lineup albeit with a few sizing tweaks.
iPhone 11 and iPhone 11 Pro.
Citing an unnamed Chinese supplier, Mac Otakara reports Apple's next-generation iPhone range, tentatively dubbed "iPhone 12," will share a case design with iPhone 11 and iPhone 11 Pro.
Until today, most predictions pointed to the adoption of a squared metal frame design that harkens back to iPhone 4 and iPhone 4S. Noted TF Securities analyst Ming-Chi Kuo first delivered word of the "significant" design change last September, saying the new frame structure would rely on a "more complex segmentation design, new trenching, and injection molding procedures."
Today's report casts doubt on Kuo's expectations and suggests iPhone will retain a metal chassis with gently bowed edges.
Seemingly confirming rumors that Apple will field three screen sizes in 2020 -- 5.4-, 6.1- and 6.7-inch variants -- sources claim to have information on chassis dimensions. The height of the smallest 5.4-inch version is said to be between that of the iPhone SE and iPhone 8, while the 6.1-inch model lies between the iPhone 11 and iPhone 11 Pro. The "iPhone 12 Pro Max" predicted to boast a 6.7-inch screen, will supposedly be slightly taller than this year's iPhone 11 Pro Max.
The report goes on to say Apple's 2020 iPhone range will boast a depth of around 7.40 millimeters, much thinner than the 8.1mm iPhone 11 Pro or 8.3mm iPhone 11. Bezel size is expected to be about 2mm, roughly equivalent to current generation iPhones.
All 2020 models are anticipated to benefit from OLED screens, a new "A14" system-on-chip processor and 5G connectivity. The entry-level 5.4- and 6.1-inch iPhones will likely sport dual rear-facing cameras, while the top-end 6.1-inch and 6.7-inch versions should carry over iPhone 11 Pro's triple-camera array. High-end iterations are also predicted to gain VCSEL time of flight sensors for depth sensing operations.