Samsung Electro-Mechanics to provide key components for Apple M2 in 2022

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Samsung Electro-Mechanics is expected to participate in the manufacturing process of the M2 Apple Silicon with production output starting before the end of 2022.

The process that Samsung Electro-Mechanics is expected to be developing is called flip chip ball grid array or FC-BGA. It is a semiconductor substrate that connects the chip to the main substrate.

According to Korea IT News, the company would develop the manufacturing process by the end of 2022 and begin supplying the FC-BGA substrates for the M2. Samsung Electro-Mechanics reportedly supplies the substrates for the M1 processor already, and has drone so since 2020.

Industry insiders suggest that Samsung Electro-Mechanics' continued participation in the manufacturing process is due to its yield quality. That despite other suppliers investing heavily in the process, their yield doesn't meet Apple's expectations.

The Samsung subsidiary also apparently supplies the RFPCBs for the iPhone 13, which connects the OLED display to the main board.

A spokesperson from Samsung Electro-Mechanics could not confirm Apple as a customer. However, the company is the number one in market share for manufacturing the semiconductor substrate.