Mike Wuerthele
A new pair of parts reportedly from the "iPhone 8" have surfaced, with one of them a single layer of the device's L-shaped motherboard, and the other what is claimed to be the edge-to-edge OLED screen for the phone.
A picture of the board was posted by Benjamin Geskin on Twitter on Sunday. It allegedly depicts one of the two layer of the "iPhone 8" motherboard, seemingly confirming reports from as early as November 2016 claiming that the device would have the stacked board.
No chips are in place on the board.
#iPhone8 PCB
— Benjamin Geskin (@VenyaGeskin1) August 26, 2017
(One of the 2 layers) pic.twitter.com/VAYhzQnMuS
Also shown on Sunday is what is said to be the screen assembly for the device. Reportedly, screen assemblies are being sold for over $5000 on the Chinese black market.
#iPhone8 Displays
— Benjamin Geskin (@VenyaGeskin1) August 26, 2017
At the moment, the price of these displays is US$5000 on the Chinese black market.
(via https://t.co/5NIfQH97FV) pic.twitter.com/zFMSWsyPAR
There is no way to authenticate either part.
The "iPhone 8" is rumored to feature an edge-to-edge OLED panel with a 5.1-inch user space with the remainder dedicated to virtual buttons. Also expected is a new 3D facial scanner, possibly supplanting Touch ID.
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19 Comments
With the release date is only a month away, at this point, it wouldn't surprise me anymore if more leaks were coming up. I am pretty sure the assembly line is working super hard right now.
This looks very different from the logic board we saw last week. Am I mixing up what part I'm looking at?